A chemistry solution.

THE PROMISE:  PRINTED SEMICONDUCTORS
Liquid-processed, printable semiconductors have been sought as an alternative to traditional semiconductor fabrication methods.  Unlike traditional semiconductor materials, liquid-processed semiconductors require lower up-front capital investments, can be manufactured using high throughput deposition (e.g., printing) techniques, and enable large area and flexible substrate applications.

THE PROBLEM:  NANOSTRUCTURE COMMUNICATION
The development of semiconductor nanostructure technology seemed to fulfill the challenge to traditional semiconductor processes.  Nanoscale structures could be manufactured in solution via wet chemistry processes.  These very small structures (a nanometer is one-billionth of a meter) could be manufactured and deposited in liquid form and provide the sought after printing and form-factor benefits. This process also promised unique material properties (electrical, optical, magnetic) that is achievable only from nanoscale structures.

While nanoscale materials were able to be commercialized, their use to construct semiconductor films was limited.  Films manufactured using these liquid-processed semiconductors had resulting poor electronic properties.  This poor performance was attributed to one pressing problem. Poor electronic communication between the nanostructures. So while solution-processed nanostructures took steps forward to reach the benefits promised by printed semiconductors, the electronic efficiency problem has hindered larger commercial output.

THE SOLUTION:  ELECTRONIC GLUE^TM
Our LiquidSemi^TM chemistries improve the electronic performance of solution-processed inorganic semiconductors by incorporating our patent-pending “electronic glues”.  The glues improve existing liquid deposition and film manufacturing processes and provide manufacturing solutions that can leverage the benefits of flexible substrates and large areas devices.  The electronic glues increase electronic communication between nanostructures and throughout the deposited semiconductor layer and can retaining the unique properties (electronic, optical, surface area) of nanostructures.